IPC 7095, “Design and Assembly Process Implementation for BGA’s,” has just been revised and the new 2013 Revision C is now available from Document Center Inc. IPC 7095C provides guidelines for BGA inspection and repair.
IPC-7095 also addresses reliability issues and the use of lead-free joint criteria associated with BGA’s. The new edition contains many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes.
The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly. Many of these issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures.
Document Center Inc. has been a reseller of IPC standards since the 1980’s. You can order your IPC documents at our webstore, www.document-center.com. Or contact us by phone (650-591-7600), fax (650-591-7617) or email (info@document-center.com). We are here to provide you with the standards you need and the expertise you want to assist you in making the correct documentation choices.
