IEC 60286-3, “Packaging of components for automatic handling – Part 3: Packaging of surface mount components on continuous tapes,” has just been released. The new Edition 5.0 replaces not only the previous IEC 60286-3 4th Edition from June 2007, but also IEC 60286-3-1 and IEC 60286-3-2, both from May 2009.
Tape packaging of surface mount components is used by automatic placement machines. The standard includes information on both tape packaging for these kinds of components and on singulated dies for test purposes and other operations.
This part of the IEC 60286 series is applicable to tape packaging without leads or lead stumps. It covers only the dimensions essential for this application. And it includes the requirements related to the packaging of singulated die products that include bare die and bumped die (flip chips).
IEC 60286-3 Edition 5.0 is considered a full layout revision. The bilingual edition has both the English and French language text. You’ll find there are significant technical changes. Those changes include:
- the integration of Type 1b from IEC 60286-3-1
- the integration of Type 2b from IEC 60286-3-2
If you use this standard, you may also be interested in the IEC publications it references:
- IEC 60191-2, Mechanical standardization of semiconductor devices. Part 2: Dimensions
- IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements, and
- IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from electrostatic phenomena – User guide
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