IPC-2223C, “Sectional Design Standard for Flexible Printed Boards,” has just been released. It provides design information for different flexible and rigid-flex printed board types. The 39 page standard is intended to establish specific design details that are to be used in conjunction with IPC-2221, “Generic Standard on Printed Board Design.” It may also be used in conjunction with IPC-2222, “Sectional Design Standard for Rigid Organic Printed Boards,” for the rigid sections of rigid-flex circuits.
The standard establishes the specific requirements for the design of flexible printed circuit applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced, dielectric in combination with metallic materials.
These interconnecting boards may contain single, double, multilayer, or multiple conductive layers and can be comprised wholly of flex or a combination of both flex and rigid.
IPC 2223 Revision C provides new design guidance and requirements for bends, folds and creases, staggered flexible layer bands, and strain relief fillets. Also included is a new design tutorial providing guidance on material selection, size and shape of flexible circuits and fabrication allowances.
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