Tag: Generic Standard on Printed Board Design

New IPC 2221 Revision B released – Generic Standard on Printed Board Design

IPC-2221 Revision B, “Generic Standard on Printed Board Design,” has just been released and is available now from Document Center Inc.  The document is available in both paper and CD Rom format, however the CD Rom does not have the capability to print.  For this reason, many users prefer the paper edition or to purchase the “kit” which includes both the paper and CD Rom copies.

IPC-2221B is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer.

Among the many updates to the new Revision B are new criteria for conductor characteristics, surface finishes, via protection, board electrical test, dielectric properties, board housings, thermal stress, compliant pins, panelization and internal and external foil thicknesses. Appendix A provides new test coupon designs used for lot acceptance and quality conformance testing.

This standard is one of our top-sellers here at Document Center Inc.  The new 170-page Revision B replaces IPC-2221A from 2003, which is now obsolete.

All IPC standards can be purchased on Document Center’s website, www.document-center.com.  Or contact us by phone (650-591-7600), fax (650-591-7617) or email (info@document-center.com).  We’ve been selling IPC standards for 30 years and can assist you with any questions or requirements you may have.

New IPC-2223 Revision C, Sectional Design Standard for Flexible Printed Boards

IPC-2223C, “Sectional Design Standard for Flexible Printed Boards,” has just been released.  It provides design information for different flexible and rigid-flex printed board types.  The 39 page standard is  intended to establish specific design details that are to be used in conjunction with IPC-2221, “Generic Standard on Printed Board Design.”  It may also be used in conjunction with IPC-2222, “Sectional Design Standard for Rigid Organic Printed Boards,” for the rigid sections of rigid-flex circuits.

The standard establishes the specific requirements for the design of flexible printed circuit applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced, dielectric in combination with metallic materials.

These interconnecting boards may contain single, double, multilayer, or multiple conductive layers and can be comprised wholly of flex or a combination of both flex and rigid.

IPC 2223 Revision C provides new design guidance and requirements for bends, folds and creases, staggered flexible layer bands, and strain relief fillets. Also included is a new design tutorial providing guidance on material selection, size and shape of flexible circuits and fabrication allowances.

All IPC standards can be purchased from Document Center Inc. at our website, www.document-center.com.  Or contact us by phone (650-591-7600), fax (650-591-7617) or email (info@document-center.com).  We’re known for our responsive and expert customer service and can help you with all your standards needs.