IPC-CH-65 Revision B, titled “Guidelines for Cleaning of Printed Boards and Assemblies,” has just been released. The standard has been updated for new technologies including lead free, no-clean and environmentally friendly chemistries.
IPC CH 65 is a collection of information on electronic board and assembly cleaning in a single location. This is a major revision that explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to cleanliness. Color pictures help you further understand the text.
There are 13 sections to the standard plus figures and tables. They include:
- Overview
- Applicable documents
- Assembly cleaning value and applicability
- Designing assemblies for cleaning
- Materials compatibility
- Process development and verification
- Contamination and its effects on Printed Wiring Boards
- Assembly residues/cleaning considerations
- Environmental considerations
- Solvent cleaning agents
- Semi-aqueous cleaning agents, equipment and process optimization
- Aqueous cleaning agents, equipment and process integration
- Cleaning for rework, repair and restoration operations
The 200 page revision replaces the previous edition IPC-CH-65A as well as IPC-SC-60A, IPC-SA-61A, IPC-AC-62A, and IPC-SM-839, all of which have been withdrawn. It is available from Document Center Inc. in paper or CD Rom format, or as a kit with both included.
Order via our website at www.document-center.com, or contact us by phone (650-591-7600), fax (650-591-7617) or email (info@document-center.com). All purchases include our free notification service which keeps you updated on all future changes to the standard.
