The European EN 62047 series covers Semiconductors, specifically micro-electro mechanical devices. MEMS, as they are known, are microsized electromechanical systems, in which sensors, actuators and/or electric circuits are integrated on a chip using a semiconductor process. The 62047 series provides terms and definitions as well as specific tests and detailed information on the topic.
Now there are three new parts that have just been released for this set, BS EN 62047-11, BS EN 62047-18 and BS EN 62047-19. They are the European adoptions of the recently release IEC 62047-11, IEC 62047-18, and IEC 62047-19. All of these standards are first editions, comprised of completely new material. I’ll cover each separately.
BS EN 62047-11, Semiconductor devices. Micro-electro mechanical devices. Test method for coefficients of linear thermal expansion of free-standing materials for micro-electro mechanical systems
This document specifies the test method to measure the linear thermal expansion coefficients of thin free-standing solid MEMS materials. These materials may be metallic, ceramic, polymeric, etc. It is used to support the BS EN 62047-3, on thin film tensile-testing. You’ll find information on the test piece, the testing equipment and process, and reporting data. There are a number of Annexes and figures to support the requirements of the standard.
BS EN 62047-18, Semiconductor devices. Micro-electro mechanical devices. Bend testing methods of thin film materials
Part 18 supports the requirements of BS EN 62047-6, Part 6: Axial fatigue testing methods of thin film materials. It specifically addresses the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm.
This standards was developed due to the fact that the main structural materials for MEMS have special features (a few micron meter size and material fabrication by deposition, photolithography and/or non-mechanical machining test piece). So this bend test has a specific test piece shape for micro-sized smooth cantilever type test pieces. This results in more accurate test measurements.
The structure of the standard is similar to that of the BS EN 62047-11, except that there is no information on test equipment since it is not extraordinary. Only the testing method itself is discussed in Section 5.
BS EN 62047-19, Semiconductor devices. Micro-electromechanical devices. Electronic compasses
Being an expert in standards, not semiconductors, this is the part of the series that really caught my eye. Part 19 addresses electronic compasses for mobile electronic equipment. These e-compasses are composed of magnetic and acceleration sensors, or sometimes just magnetic sensors alone.
The standard covers terms and definitions, ratings and characteristics, and measuring methods for these components (with the exception of marine electronic compasses.) There are 3 informative Annexes as well:
- Considerations on essential ratings and characteristics
- Terminal coordinate system of e-compasses
- Descriptions of pitch angle, roll angle and yaw angle with drawings
A bevy of figures and tables are also included.
This is the first standard I can find for non-marine electronic compasses. When you think about how you use your mobile devices to get you from place to place, it is really fascinating.
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