As lead-free techniques continue to be used in the electronics industry, the supporting standards are being modified to reflect the increased understanding of the behaviors and requirements of this development. So it is no surprise that the IEC 61190-1-2 was revised this year, nor that the EN adoption has already taken place. The resulting new BS EN 61190-1-2, 2014 Edition, is available now. Titled “Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly,” it serves as a quality control document.
Requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections for electronics assemblies are covered. And of course, the usage can be expanded to pastes used in soldering in general. You’ll get definitions of properties and the specification of test methods and inspection criteria. Although the bulk of the document is devoted to the test methods, requirements, and quality assurance provisions, there’s also sections on preparation for delivery and performance and shelf life extension inspections.
EN 61190-1-2 includes solder powder and paste flux blended to produce your solder paste. Solder powders are classified by both the shape and size distribution of the powder particles.
Changes in the latest edition (which cancels and replaces the 2007 Edition) are as follows:
- Solder powder size in table 2 has been revised
- Annex B has been extended to include information on reflow condition and profile
- Annex C has been added (Typical comparison of particle size distributions between laser diffraction method and screen method)
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